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Kit-Tronics :: Memory :: Mushkin :: ASCENT
“By combining high frequency memory chips into a package uniquely designed to handle increased heat and voltage demands, the Ascent product line offers gamers and other PC enthusiasts a new level of performance,” said Brian Flood, director of product development for Mushkin. “The line boosts maximum performance by keeping the memory chips up to 48 per cent cooler using Celsia’s new eVCI technology.”
At the heart of Mushkin’s eVCI cooling solution are two 123mm x 25mm liquid filled copper vapor chambers developed by Celsia Technologies www.celsiatech.com that
are encased on the outer dimensions by high conductivity 6063 aluminum alloy. In direct contact with 95% of the memory chip surface area, the vapor chambers effectively eliminate hot spots on the chip and quickly transfer heat to the aluminum where it is dissipated into the surrounding air.
eVCI, Celsia’s unique vapor chamber solution, was exclusively designed for the Mushkin Ascent line of Redline and XP memory modules, and the new line is among the first to use this innovative approach to rapid cooling of high performance chips. Additionally, the low profile, thin design allows full usage of all memory slots while complementing many of the largest CPU coolers, which often limit memory module height.
“The gamers we’re targeting with this new product line are extremely sensitive to the available memory slots they have for upgrades so the slim design of this new line will be particularly attractive to them as well,” added Flood.
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